WEISUN Full-Automation Oven(Wafer Type)
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Features
- EFEM(IPC Base, Robot,Load-port,Alinger, X-table & S/W Integration), High steady & Good S/W solution. Suit for 8
- Full-Automation, Integrate EFEM & Oven, data upload to Server directly, attain Unmaaned status(non-operator)
- Program: GUI Interface, For
- Temperature: RT~600℃ & Uniformity: +/- 2℃ & O2 Density: < 20 ppm & Cooling: N2 Air & Water Cooling-down & Capacity: Wafer Q`ty, Single chamber: 50 pcs & Twin-Chamber: 100 pcs & Adapter EQ: EFEM(OHT) / AGV / MGV
Product Information
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Manufacturer
WEISUN APPARATUS CO.,LTD. -
Manufacturing process
Wafer Level Curing (PR/PI Curing or Focus on Bumping/WLCSP) -
Product
Auto-Oven
BUSINESS CONTACTS
If you have further needs, please contact us, we have a professional staff will serve you.
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Andy Hsu
- Tel : 03-3529332 ext.626
- Mail : andy_hsu@wkk.com.tw
