Optoelectronic Communication
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Semi auto high precision die bonder - BL100
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Auto high precision die bonder - CL1000
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Chip on Submount Die Bonder BL-Series
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Automated Micro-Optics Assembly AL-Series
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FAC lenses
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SAC lens
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FISBA Beam Twister™ (FBT)
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Ultra small laser module for illumination: FISBA RGBeam™
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