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ECI SurfaceScan QC-100

SERA 是使用一種電鍍藥液技術可以使用來確認不同膜厚的參數. 此參數可以用來鑑定和預料PCB 板, 半導體晶圓和 Lead frame 的 銲錫性, 金屬連接性和附著性

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Features
  • SERA is an electrochemical technique used to determine a variety of key coating parameters. These parameters are then used to evaluate and predict the solderability, wirebondability and adhesion characteristics of PCB or wafers and lead frame.
  • Application:
  • * PCB, Semiconductor, Wafer Bumping
  • * Suit for Co, Ni, Cu, Ag, Au, In, Sn, Sb, Pb, and Bi analysis
  • * Particularly targeted Copper, Solder, Immersion Gold and Tin.
  • Features:
  • * Pre-evaluate PTH, SMT, components and lead frame
  • * Non-destructive testing for surface of metals.
  • * Use Redox Potential for metal oxide detection
  • * OSP thickness measurement
  • * Easy and safety to use
Product Information
  • Manufacturer
    ECI
  • Manufacturing Process
    Electroplating process / Plating Bath Analyzer
  • Product
    SurfaceScan QC-100
BUSINESS CONTACTS

If you have further needs, please contact us, we have a professional staff will serve you.

  • CONTACT
    Joe Chiu
    • Tel : 03-3529332 ext. 704
    • Mail : joe_chiu@tkk.com.tw
  • CONTACT
    Darren Hsu
    • Tel : 03-3529332 ext.700
    • Mail : darren_hsu@tkk.com.tw
  • CONTACT
    Hank Chuang
    • Tel : 03-3529332 ext.642
    • Mail : Hank_Chuang@tkk.com.tw