Auto high precision die bonder - CL1000
The CL1000 multi-purpose die bonder is a system designed for customers in the semiconductor and photonics packaging market.
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機能・特性
- +/- 2 μm bonding accuracy.
- Large number of functional application modules.
- High precision 4 axes motion system, 3 lateral, 1 rotatory.
製品情報
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MANUFACTURER
finconTEC -
MANUFACTURING PROCESS
Multi porpose -
Details
Die Bonder
