WEISUN High Temperature Clean & Non-Oxidation Oven
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機能・特性
- Half & Full Automation Type(PLC Base & Auto-Door Design)
- Program: PC & PLC Base, Enthernet Link, For
- Cleanliness(Particle): < Class 100 & Temperature: RT~550℃ & Uniformity: +/- 2℃ & O2 Density: < 20 ppm & Cooling: N2 Air & Water Cooling-down & Capacity: Customize & Adapter: AGV / MGV
製品情報
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Manufacturer
WEISUN APPARATUS CO.,LTD. -
Manufacturing process
Wafer Level Curing (PR/PI Curing or Focus on Bumping/WLCSP or Focus on LED/LCD/PCB/Assembly) -
Product
High Temperature Clean & Non-Oxidation Oven
