ECI SurfaceScan QC-100
SERA 是使用一種電鍍藥液技術可以使用來確認不同膜厚的參數. 此參數可以用來鑑定和預料PCB 板, 半導體晶圓和 Lead frame 的 銲錫性, 金屬連接性和附著性
1
2
機能・特性
- SERA is an electrochemical technique used to determine a variety of key coating parameters. These parameters are then used to evaluate and predict the solderability, wirebondability and adhesion characteristics of PCB or wafers and lead frame.
- Application:
- * PCB, Semiconductor, Wafer Bumping
- * Suit for Co, Ni, Cu, Ag, Au, In, Sn, Sb, Pb, and Bi analysis
- * Particularly targeted Copper, Solder, Immersion Gold and Tin.
- Features:
- * Pre-evaluate PTH, SMT, components and lead frame
- * Non-destructive testing for surface of metals.
- * Use Redox Potential for metal oxide detection
- * OSP thickness measurement
- * Easy and safety to use
製品情報
-
Manufacturer
ECI -
Manufacturing Process
Electroplating process / Plating Bath Analyzer -
Product
SurfaceScan QC-100
